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    Soldering

    Pulsed Heat HBR HSC ACF Bonding System

    MODEL NO.: HB212/202
    MODEL NO.: HB213/203
    Pulsed Heat HBR HSC ACF Bonding System HB212 202 213 203

    Features

    1) Realtime temperature and force profile display on the LCD touch screen.
    2) Titanium alloy thermode ensure uniform temperature distribution,
    fast heating and longest service life.
    3) Password protection for process and system parameters.
    4) Level mechanism for components co-planarity adjustment.
    5) English / Simplified Chinese user interface display.
    pulsed-heat-hbr-hsc-acf-bonding-system-hb212-202-213-203-3

    Options
    1) Tape Feeding System (TFS1) for holding silicon or Polyimid (Kapton) tape.
    2) Colour (CC19) alignment module for TAB/flex to PCB/LCD.
    3) Thermal Profiling Unit (TPU1); additional thermocouples
    for temperature profile monitoring.
    pulsed-heat-hbr-hsc-acf-bonding-system-hb212-202-213-203-2





    HB212 / 202 Technical Specifications
    HB212 202
    SYSTEM SPECIFICATIONS
    Dimensions (Without signal tower) 750 mm x 760 mm x 558 mm
    Weight (Not including the CCD and LCD monitor) 88 Kg
    Power consumption 220V / 60Hz or 110V / 50Hz, 2KVA (Factory preset)
    Air supply 4 to 6 Kg/cm2
    Maximum fixture height 48 mm
    Fixture assembly baseplate 150 mm x 150 mm ( 1 sets)
    Starting operation method Two hand control
    Turntable actuation Pneumatic (PBS212); Manual (PBS202)
    Vacuum for components holding 1 sets 1 sets; built-in
    Password 6 digits (2-level)
    THERMODE SPECIFICATIONS
    Force range 30 N to 500 N
    Force accuracy ±2 N
    Actuation type Pneumatic
    Thermode stroke 50 mm maximum
    Thermode length 100 mm maximum
    PULSED HEAT CONTROL SPECIFICATIONS
    Heating method Pulsed heating, high speed PID control
    Temperature range preheat 50 to 50 to 500℃ (1 degree increment)
    Temperature range heat 50 to 500 ℃(1 degree increment)
    Time period preheat 1 to 60 seconds (1 second increment)
    Time period heat 1 to 60 seconds (1 second increment)
    Temperature accuracy ±2℃
    Programmable heat profile 3 programs, non-volatile
    Thermocouple K type
    Communication port RS-232C




    HB213 / 203 Technical Specifications
    HB213 203
    SYSTEM SPECIFICATIONS
    Dimensions (Without signal tower) 630 mm x 520 mm x 500 mm
    Weight (Not including the CCD and LCD monitor) 66 Kg
    Power consumption 220V / 60Hz or 110V / 50Hz, 2KVA (Factory preset)
    Air supply 4 to 6 Kg/cm2
    Maximum fixture height 48 mm
    Fixture assembly baseplate 150 mm x 150 mm (2 sets)
    Starting operation method Two hand control
    Turntable actuation Pneumatic (PBS213); Manual (PBS203)
    Vacuum for components holding 1 sets 2 sets; built-in
    Password 6 digits (2-level)
    THERMODE SPECIFICATIONS
    Force range 20 N to 500 N
    Force accuracy ±2 N
    Actuation type Pneumatic
    Thermode stroke 50 mm maximum
    Thermode length 100 mm maximum
    PULSED HEAT CONTROL SPECIFICATIONS
    Heating method Pulsed heating, high speed PID control
    Temperature range preheat 50 to 50 to 500℃ (1 degree increment)
    Temperature range heat 50 to 500 ℃(1 degree increment)
    Time period preheat 1 to 60 seconds (1 second increment)
    Time period heat 1 to 60 seconds (1 second increment)
    Temperature accuracy ±2℃
    Programmable heat profile 3 programs, non-volatile
    Thermocouple K type
    Communication port RS-232C
     

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